Automated Eutectic Die Attach technique rings high notes for new volume and accuracy demands
نویسنده
چکیده
Today`s telecommunications/datacom industry is coping with its own technical challenges in processing capabilities as it juggles demands for greater electrical performance and reduced sizes. Particularly hot in technical slate are automatic eutectic attachment techniques, which are desirable for high-performance and high-capacity die attach applications. Actually, the eutectic die attach technique is nothing new. This die bonding technique has been widely explored and employed, particularly on manual die-bonding equipment.
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